@MARPOSS Group is also growing its presence in the semiconductor and consumer electronics sector. Keeping processes under control is a key factor in any manufacturing. This is even more true in highly demanding semiconductor and semiconductor-like manufacturing processes, considered some of the most complex processes, requiring control of more and more parameters. It should also be remembered that semiconductors are brittle and hard materials, so they require specialized machine tools to slice, lap, thin, intelligent and finally cut the dies.
Inspection and metrology are key components in improving and maintaining high yields and are essential in controlling the semiconductor manufacturing process to find defects on both patterned and unpatterned wafers.
Marposs engineers are ready to support you in defining how to improve the performance of automated machines used in wafer processing, front-end and back-end manufacturing steps: in fact, we offer sensors and gauges for slicing and lapping machines, backgrinders, dicing saws, wafer shape (bow/warp) measurement, layer and pattern measurement, bump and groove measurement.
The semiconductor and semiconductor-related industries continue to produce smaller and smaller devices that are more complex in both geometry and materials. For these purposes, Marposs offers a complete range of non-contact sensors used in thin film metrology, wafer dimensional characterization, wafer inspection and package inspection. Our sensors can operate within automatic inspection machines to detect defects and dimensional variations.
Here are some examples of how our products can benefit you:
1- Solarius
Marposs has already announced the acquisition of Solaius Development Inc., a leading provider of high-tech manufacturing solutions to the consumer electronics and semiconductor industries.
The new Phoenix Desktop 3D surface measurement system from Solarius enables highly accurate and precise 3D surface inspection. Phoenix expands the scope of application with a wide range of instruments that support easy automation of measurement tasks.
The Phoenix Desktop 3D system is based on chromatic confocal technology dedicated to industrial environments and features sub-micrometer accuracy and nanometer axial resolution independent of ambient light. The optical system design and calculations respect the optimal physical directional limits of the optical system, enabling accurate, precise and reproducible lateral measurements.
Phoenix features a comfortable and precise automatic X/Y positioning unit with a travel range of 150mm x 150mm and a height measurement range of 100m. The height measurement range can be adjusted up to a maximum height of 150mm using a precise manual travel unit. Phoenix has six different sensors with sensor heads capable of measuring 45, 90 or 180 points, designed to meet the metrology requirements of mechanical, semiconductor, 3C, glass, automotive, aerospace and medical.
2-NCG Fine Wire
NCG is a distance/thickness measurement system based on interferometric technology. Waves reflected at layer boundaries on different surfaces of the measured object (two or more in the case of multi-layer materials) interfere with each other and the layer thickness is calculated. The gauge is designed to allow the control of part thicknesses of different materials, such as silicon, doped silicon, SiC, sapphire, GaN, glass, GaAs, SOI and plastics. Thanks to the infrared light source, even opaque materials can be measured. NCG can be equipped with different light emitters covering several thickness ranges for each material, down to a limit of a few microns. A wide range of interferometric probes is available to suit measurements performed in clean environments but also in the harsh conditions typical of machine tools.
NCG is also equipped with powerful measurement refinement software that can provide “clean” measurements even in optically noisy environments, and can efficiently track the measurement of each single layer, even in multi-layer materials that are easily confused with each other.
The NCG can be used and programmed through a dedicated human interface suitable for all offline applications. Furthermore, measurements performed by the NCG can be transferred to other machines (machine tools, complex measuring benches, etc.) through various protocols provided in a special software package together with the electronic unit.
3-P3CF + Unimer
P3CF is a high-precision measurement system that combines chromatic confocal and touch measurement technology. The confocal probe is connected to the controller via a fiber optic cable. Different confocal probe models are available to suit both clean environments and the harsh conditions typical of machine tools. The touch probes belong to the UNIMAR family, known for their versatility and reliability in all kinds of processes.
P3CF is the ideal solution when indirect thickness measurements are required: when direct thickness measurements are not possible due to the inability of standard NIR (near infrared) waves to penetrate the material, the thickness of the target can be measured by obtaining the distance to the target through a confocal probe (without touching it) and subtracting the distance of the target’s support detected with standard UNIMAR (supports are usually hard and often have poor optical reflectivity, so a contact probe is the best solution).
P3CF can be used and programmed through a dedicated human interface suitable for all offline applications.
Furthermore, measurements performed by the P3CF can be transferred to other machines (machine tools, complex measuring benches, etc.) through various protocols that are provided in a special software package together with the electronic unit. For a high degree of integration in factory networks, the system also supports the most common types of fieldbuses.
Find out more about Marposs solutions for the semiconductor industry here: http://www.stilsa.com/ For more information, call Marposs in India on 0124 473 5776/765 or email us at Sales@in.marposs.com.
